In addition to the study, fabrication and experimental test on optomechanical nanostructures, HOT has the aim to demonstrate the feasibility of fabricating and packaging prototype HOT-devices exploiting standard methods of the CMOS-industry, including Silicon photonics. While unconventional processing is not a priori a show-stopper for commercialization, the ability to utilize standard processes opens the door to massively parallel batch processing, a requirement for consumer market applications in large volumes. The packaging activity will be based on both Ceramic and Organic base structures for the package. Both technologies represent a standard in every sector of microelectronics and optics. The first one is mainly used for obtaining full hermetic enclosure and good reliability in respect to harsh environments, the second is very advantageous both in terms of development and unit level production cost.